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NXP Semiconductors
PESDxL4UF/G/W
Low capacitance unidirectional quadruple ESD protection diode arrays
9. Packing information
Table 10. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code. [1]
Type number
Package
Description
Packing quantity
3000
4000
5000
8000
10000
PESD3V3L4UF
PESD5V0L4UF
PESD3V3L4UG
PESD5V0L4UG
PESD3V3L4UW
SOT886
SOT886
SOT353
SOT353
SOT665
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T4
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T4
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
2 mm pitch, 8 mm tape and reel
[2]
[3]
[2]
[3]
[2]
[4]
[2]
[4]
-
-
-
-
-115
-125
-115
-125
-
-
-
-
-
-
-
-
-
-
-115
-132
-115
-132
-
-
-
-
-
-
-
-
-
-
-
-
-
-315
-
-
-
-
-135
-165
-135
-165
-
4 mm pitch, 8 mm tape and reel
-
-115
-
-
-
PESD5V0L4UW
SOT665
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
-
-
-
-115
-
-
-315
-
-
-
[1]
[2]
[3]
[4]
For further information and the availability of packing methods, see Section 13 .
T1: normal taping
T4: 90 ° rotated reverse taping
T2: reverse taping
10. Soldering
1.250
0.675
0.370
(6 × )
0.500
0.270
(6 × )
1.700
0.500
solder lands
solder paste
occupied area
Dimensions in mm
0.325
(6 × )
0.425
(6 ×)
sot886_fr
Re?ow soldering is the only recommended soldering method.
Fig 13. Re?ow soldering footprint PESDxL4UF (SOT886)
PESDXL4UF_G_W_4
? NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 28 February 2008
12 of 17
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